In the manufacturing industries, price is always a factor. In the LED manufacturing industry this has been a sticking point for end consumers, who are price conscious.
The need to standardize the LED manufacturing process is greater than ever. Therefore many LED manufacturers are taking it upon themselves to introduce a system that would be the same across the board for all LED-based products. Any differentiating factors would be made at the end of the manufacturing process.
By streamlining the production process for all LED products, manufacturers could reduce costs by up to twenty percent by 2020. These savings could make LED retail products that more attractive to customers – both as individuals and as businesses.
LED Tool Patterning Efficiency
Currently the LED wafers that comprise the LED diodes are formed using very specific patterning technology. These patterning tools gage the different sizes of the required LED wafers. The current process is somewhat inefficient with a high degree of warping due to poor alignment.
In order to curtail this problem and produce LED wafers at a higher rate of efficiency, LED manufacturers are turning to other tool patterning design structures. One such structure requires that LED wafers be assembled vertically. This method would result in a much lower rate of warping, due to the ability to conduct heat more efficiently.
Controlling The Heat
LEDs face an uphill struggle when it comes to thermal heat management. Silicones are quickly becoming the solution to that battle. Silicone materials have a high transparency rate that is perfect for thermal heat reduction and stability.
Manufacturers can use silicone material both as a capsule or a mould for an LED product. The flexibility that this material provides can speed up and reduce LED manufacturing costs.
Increasing LED Wafer Sizes
Currently LED wafers are produced in four or six inch strips. Manufacturers are looking to increase the wafer sizes to eight inches. This small change could result in higher productivity and reduced production costs, however quality levels do suffer.
Wafer uniformity levels can be affected adversely by this change. However manufacturers can address this problem by maintaining a vigilant tool patterning process.
Controlling Defects and Managing Yield
Currently LED manufacturers do not have a standardised database that tracks and categorizes LED product defects. This means that it is much harder to pinpoint areas in the manufacturing process that are consistently unproductive.
Certain types of defects in LED manufacturing will always affect the batch yield – others have no effect on yield. By tracking and classifying all types of LED defects during the manufacturing process, manufacturers will be more able to address the ones that truly affect the bottom line.
LED Packaging Materials
LEDs are traditionally packaged in PLCCs (plastic leaded chip carriers). Recent modifications in these PLCC packages have made them more reliable and cost efficient. Future design developments could involve using a selection of materials in LED PLCCs that would be able to better manage the fluctuating heat changes in LED products.
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